L



Index


[SYMBOL] [A] [B] [C] [D] [E] [F] [G] [H] [I] [J] [K] [L] [M] [N] [O] [P] [Q] [R] [S] [T] [U] [V] [W] [X] [Y] [Z]

L-CHS parameters,
L1 cache [See Level 1 cache,.]
L2 cache [See Level 2 cache,.]
L3 cache, 2nd
Labtec Enterprises, Inc.,
Lakeport (945 Express family) chipsets,
LAN setting (BIOS),
Lancaster, Don,
lands
     CD-ROMs
     DVD discs
LANs (local area networks) [See also wireless networks,.]
     cables
         buying tips
         cable distance limitations
         Direct Cable Connection technology
         grounding loops
         installation
         Thicknet
         Thinnet
         twisted-pair
     client/server networks
     defined
     Ethernet
         cables
         defined
         Fast Ethernet
         Gigabit Ethernet
         hubs 2nd
         network adapter connectors
         switches 2nd
         Wi-Fi (Wireless Fidelity) 2nd
     gateways
     hardware and software requirements 2nd
     HomePNA
     hubs
         buying tips
         compared to switches
         dual-speed
         managed/unmanaged
         placement of
         ports
         stackable
     infrastructure mode
     network topologies
         bus
         comparison of
         ring
         star
     networking software
     NICs (network interface cards)
         bus types
         connectors
         costs
         full-duplex
         half-duplex
         installation
         speed
         testing
         Wi-Fi (Wireless Fidelity)
     peer-to-peer networks
     powerline networking
     protocols
         Ethernet
         IP (Internet Protocol)
         IPX (Internetwork Packet Exchange)
         NetBEUI
         TCP/IP 2nd
     recording information about
     switches
         address storing
         buying tips
         compared to hubs
         dual-speed
         placement of
         ports
         stackable
     tips and tricks
     Token-Ring
     troubleshooting
     wireless networks 2nd
         Bluetooth
         comparison of standards
         topologies
         Wi-Fi (Wireless Fidelity) 2nd
laplink cables,
laptops
     386SL
     keyboards
     Pentium II Mobile Module
     Wi-Fi (Wireless Fidelity)
Larson, Earl R.,
Laser Beam Recorder (LBR),
lasers,
latency,
     hard disk drives
     SDRAM (synchronous DRAM)
latent heat of evaporation,
layered architecture,
LBA (logical block address) addressing,
     BIOS commands
     compared to CHS (cylinder head sector)
     converting to CHS (cylinder head sector)
     LBA-assist translation
LBR (Laser Beam Recorder),
LCD (liquid crystal display) monitors
     active-matrix
     advantages of
     brightness and contrast
     buying tips
     compared to CRT
     costs
     dead pixels
     DFP (Digital Flat Panel)
     disadvantages of
     display connections
     flat-panel
     interlaced/noninterlaced
     monochrome
     passive-matrix
     polarizing filters
     projectors
     resolution
     subpixels
     wide-screen
lead-in areas
     CD-ROMs
     DVD discs
lead-out areas
     CD-ROMs
     DVD discs
leased lines
     choosing
     defined
     PoP (point of presence)
     T-1 connections
     T-3 connections
LED connectors,
legacy support,
     sound cards
     USB (Universal Serial Bus) 2nd
legacy-free PCs,
Lempel, Abraham,
letters (drive), assigning,
Level 0 (RAID),
Level 1 (RAID),
Level 1 cache, 2nd
     cache misses
     cache operation
     compared to Level 2 cache
     importance of
     NexGen Nx586 processors
     Pentium II processors
     Pentium Pro processors
     Pentium-MMX improvements
Level 2 (RAID),
Level 2 cache,
     cache operation
     compared to Level 1 cache
     Pentium II processors
     Pentium II/III Xeon processors
     Pentium III processors
     Pentium Pro processors
     Pentium processors
     performance and design
Level 3 (RAID),
Level 3 cache, 2nd
Level 4 (RAID),
Level 5 (RAID),
Level 6 (RAID),
level-sensitive interrupts,
Lexar Memory Stick Pro,
LFX12V power supply,
LG Electronics,
LGA775 sockets, 2nd
LIM (Lotus Intel Microsoft),
line conditioners,
line regulation,
line-in sound card connectors,
line-of-sight issues,
line-out sound card connectors,
linear density,
linear power supply,
Linear Tape-Open (LTO),
Linear Technology,
linear voice-coil actuators,
linking systems
     parallel ports
     USB ports
liquid cooling
     heat pipes
     refrigeration
     water cooling
Lisa computers, 2nd
lithium coin cell batteries,
LLF [See low-level formatting,.]
LMS,
load regulation,
load/unload head mechanism,
loading coils,
loading mechanisms (CD/DVD drives),
loads (power supply), 2nd
local area networks [See LANs (local area networks).]
local buses [See buses,.]
lockups, troubleshooting, 2nd 3rd 4th
logging events,
logic boards, 2nd
logic probes,
logic pulsers,
logical block address [See LBA (logical block address) addressing,.]
logical formatting [See low-level formatting,.]
logical mapping,
logical memory,
     conventional memory
     UMA (Upper Memory Area)
         adapter ROM
         host adapter BIOS
         IPL ROM
         motherboard BIOS
         shared memory
         VGA memory
         video adapter BIOS
         video RAM
     XMS (Extended Memory Specification)
logical ring topology,
Logitech
     contact information
     mouse devices
longitudinal density,
loopback connectors,
loopback testing,
Lotus Intel Microsoft (LIM),
low profile form factor (LFX12V) power supply,
low volume, troubleshooting,
low-level formatting,
     ATA (AT Attachment)
     nondestructive formatters
     SCSI (small computer systems interface)
     standard recording
     ZBR (zoned-bit recording)
low-pass filters,
low-temperature polysilicon (p-Si),
LPX motherboards,
     connectors
     dimensions
     expansion slots
     identifying
     LPX-compatible products
     power supply
     power supply connectors
     riser cards
     upgrading
LTO (Linear Tape-Open),
lubricants,




Upgrading and Repairing PCs
Upgrading and Repairing PCs (17th Edition)
ISBN: 0789734044
EAN: 2147483647
Year: 2006
Pages: 283
Authors: Scott Mueller

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