L1 (Level 1)L2 (Level 2)L3 (Level 3)LAN (local area network)LAPM (link-access procedure for modems)LBA (logical block address)LCC (leadless chip carrier)LCD (liquid crystal display)LED (light-emitting diode)LGA (Land Grid Array)LIF (Low Insertion Force)LIM (Lotus Intel Microsoft)LLF (low-level formatting)LPT (line printer)LSI (large-scale integration)LTO (linear tape-open)LUN (logical unit number)LVD (low voltage differential)LZW (Lempel Ziv Welch)
L1 (Level 1)
L2 (Level 2)
L3 (Level 3)
LAN (local area network)
LAPM (link-access procedure for modems)
LBA (logical block address)
LCC (leadless chip carrier)
LCD (liquid crystal display)
LED (light-emitting diode)
LGA (Land Grid Array)
LIF (Low Insertion Force)
LIM (Lotus Intel Microsoft)
LLF (low-level formatting)
LPT (line printer)
LSI (large-scale integration)
LTO (linear tape-open)
LUN (logical unit number)
LVD (low voltage differential)
LZW (Lempel Ziv Welch)