tag acquisition speed testing, 127–129
tag identification (TID) memory, 92
tag-talks-first (TTF) signals, 79
tags, 77–78
active, 79–80
antenna production for, 94
chips in, 93
classes, 90–92
communication, 83–85, 84
encoding, 154–155
exam essentials, 108–110
high-frequency, 86
international frequencies, 88–90
key terms, 110
low-frequency, 85–86
management, 30–31
material-specific, 99–100
microwave, 88
modulation for, 95–96
optimizing, 204
orientation, 102, 103–104
packaging, 96–99, 104–105
passive, 80–81
placement, 100–107
pros and cons, 82–83
Q factor in, 96
quality, 211–212
review questions, 111–116
semi-passive, 82
summary, 107–108
ultra-high-frequency, 86–87
TAGSYS company, 265
tangential component of electric fields, 11
Technical Design Review Team (TDRT), 173
Telecommunication Development sector, 234
Telecommunication Standardization sector, 234
Telnet for light stack controls, 178
TEM (transverse electromagnetic) waves, 5
temperature
and labels, 152
of readers, 203, 213
and tags, 99
terminators for readers, 186
test equipment in site analysis, 60
testing
readers, 177–179, 177
tag placement, 105–107
Texas Instruments, Inc., 265
thermal printing method, 151–152
ThingMagic, 266
TID (tag identification) memory, 92
time-division multiplexing, 41
time in beam factor, 34, 35
time-varying magnetic fields, 4
transmission restrictions, 29–30
transmitters
in active tags, 79
in interrogators, 25
transverse electromagnetic (TEM) waves, 5
triggering devices, 28, 156–157
tripod stands, 60–61, 65
troubleshooting and optimizing, 201–202
antennas, 204, 210–211, 211
cause determination, 205–207, 207
exam essentials, 220–221
interference, 207–210, 209
isolation steps, 216–217
key terms, 221
large-scale deployments, 214–215
middleware, 205
physical layout, 214
protocols for, 215–216
radiation containment, 217–219
readers, 203, 213–214
review questions, 222–227
summary, 219–220
tags, 204, 211–212
TTF (tag-talks-first) signals, 79
tuning antennas, 39–40, 210–211, 211
tunnels, 39